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Download Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® High quality books

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
By:Erdogan Madenci,Ibrahim Guven,Bahattin Kilic
Published on 2002-12-31 by Springer Science & Business Media

CD-ROM contains: |computer programs that complement the material within the book.|

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Book ID of Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®'s Books is E7HOfOQsgpEC, Book which was written byErdogan Madenci,Ibrahim Guven,Bahattin Kilichave ETAG "p3H9V2Is0/Y"

Book which was published by Springer Science & Business Media since 2002-12-31 have ISBNs, ISBN 13 Code is 9781402073304 and ISBN 10 Code is 1402073305

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Book which have "185 Pages" is Printed at BOOK under CategoryComputers

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