Electronic Packaging Materials and Their Properties High quality books
Electronic Packaging Materials and Their Properties
By:Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan
Published on 1998-12-18 by CRC Press

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
This Book was ranked at 16 by Google Books for keyword electronic.
Book ID of Electronic Packaging Materials and Their Properties's Books is _uWNnTYwc2IC, Book which was written byMichael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajanhave ETAG "fQw073SbxV0"
Book which was published by CRC Press since 1998-12-18 have ISBNs, ISBN 13 Code is 9780849396250 and ISBN 10 Code is 0849396255
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Book which have "128 Pages" is Printed at BOOK under CategoryTechnology and Engineering
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